It cures at low temperatures to avoid damage to electronic equipment and bonds well to most materials.
Silver epoxy adhesive.
It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive connections.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.
The mg chemicals 8331 is a two part silver filled epoxy adhesive with good conductivity and a faster working time than mg chemicals 8331s adhesive to bond electronic devices form conductivity seals and cold solder heat sensitive materials.
Excellent peel and shear strength.
8331 is an electrically conductive silver filled two part epoxy adhesive.
This product allows for quick cold soldering repairs.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.
Serviceable from 4k to 250 f.
This product allows for quick cold soldering repairs.
It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive.
8331 is an electrically conductive silver filled 2 part epoxy adhesive.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.
One component heat curing silver conductive epoxy adhesive.
Silver filled electrically conductive epoxy adhesive.
This adhesive bonds very well to a variety of surfaces.
Resists vibration impact thermal cycling.
Cures at room temperature.
It has a convenient 1 to 1 ratio ten minutes work life and a moderate curing rate.
The 8331 silver conductive epoxy adhesive.
It can be used as a solder replacement for bonding heat sensiti.